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MediaTek Unveils Dimensity 9300+ Flagship Chipset and AI Pioneer Program for Global Developers

MediaTek launches Dimensity 9300+ flagship 5G chipset at MDDC 2024. The chipset features a big-core CPU architecture and supports generative AI applications. MediaTek partners with industry leaders for the Dimensity AI Pioneer Program.

The announcement was made at the MediaTek Dimensity Developer Conference (MDDC) 2024 held in Shenzhen. With the theme "AI Empowers Everything," the conference explored the advancements and applications of artificial intelligence (AI) technology across various domains.


The Dimensity 9300+ chipset, built on TSMC's third-generation 4nm process technology, takes center stage at MDDC 2024. It features a big-core CPU architecture, comprising four Cortex-X4 ultra-large cores clocked at up to 3.4 GHz and four Cortex-A720 large cores operating at 2.0 GHz. MediaTek claims that this configuration ensures low power consumption and enables smartphones to deliver sustained high performance over extended periods.


One of the key highlights of the Dimensity 9300+ is its support for on-device LoRA Fusion and NeuroPilot LoRA Fusion 2.0 technology. This allows developers to quickly introduce new generative AI applications involving text, voice, imagery, and music. The chipset also integrates a 2nd-gen hardware ray-tracing engine with an Arm Immortalis-G720 GPU, delivering console-grade global illumination effects for gamers.


To further enhance the gaming experience, MediaTek's HyperEngine technologies optimise power efficiency for longer battery life. The chipset's Network Observation System improves dual-network concurrency and offers up to 10% power savings and 25% cellular data savings.


In addition to the chipset launch, MediaTek unveiled the Dimensity AI Pioneer Program for global developers. The program aims to provide resources, technical support, and business opportunities for developers to create innovative generative AI experiences on Dimensity-powered devices. Collaborating with industry partners such as Alibaba Cloud, Baichuan Intelligence, Transsion, Oppo, Honor, Vivo, and Xiaomi, MediaTek is committed to fostering a vibrant ecosystem for AI development.


Simultaneously, MediaTek partnered with Alibaba Cloud, Baichuan Intelligence, Huya, Kugou Music, Oppo, Tencent AI Lab, and Vivo to release a Generative AI Smartphone Industry White Paper. This white paper defines generative AI smartphones as devices that utilise large-scale, pre-trained generative AI models to achieve multi-modal generation, context awareness, and evolving human-like capabilities. Industry analysis firm Counterpoint predicts rapid growth for generative AI phones, with a global user base of around one billion expected by 2027.


MediaTek's launch of the Dimensity 9300+ comes on the heels of Qualcomm's Snapdragon 8s Gen 3 chipset. With MediaTek maintaining a 36% share of the global smartphone chipset market in Q4 2023, the competition between the two companies is fierce. As the smartphone industry experiences slow growth, MediaTek is aggressively vying for Qualcomm's market share.

 
  • MediaTek launches Dimensity 9300+ flagship 5G chipset at MDDC 2024.

  • The chipset features a big-core CPU architecture and supports generative AI applications.

  • MediaTek partners with industry leaders for the Dimensity AI Pioneer Program.


Source: TECHNODE

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